Olympus BX51M Metallurgical Microscope (DIC)

Description

Olympus BX51M Metallurgical Microscope with DIC The Olympus BX51M is a high-quality upright metallurgical microscope specifically developed for advanced material analysis, quality control, and research applications. Thanks to the UIS2 Infinity Optical System, the microscope delivers exceptionally high resolution, true-to-life color reproduction, and a flat image across the entire field of view. This configuration features a DIC (Differential Interference Contrast) set, allowing even extremely small height differences and surface details to be visible with high contrast. This makes the BX51M particularly suitable for inspecting metals, semiconductors, coatings, electronic components, and other industrial materials where conventional bright-field microscopy falls short. The microscope is equipped with a trinocular tube for connecting a digital camera, a mechanical stage, a multi-objective turret, and high-quality Olympus objectives: Olympus MPLNFL N 4x Olympus MPLANFL N 10x Additional objectives are available at an extra cost for higher magnification applications. Key Features Olympus BX51M Metallurgical Microscope Equipped with Differential Interference Contrast (DIC) Olympus UIS2 Infinity Corrected Optical System Trinocular tube for camera connection Mechanical XY stage Multi-objective turret High-quality plan objectives Modularly expandable Suitable for image acquisition and analysis Technical Specifications Specification Value Model Olympus BX51M Type Upright metallurgical microscope Optical System Olympus UIS2 Infinity Optical System Contrast Method Brightfield + DIC (Differential Interference Contrast) Tube Trinocular Camera Connection Yes Turret Multiple objective turret Terminal stage Mechanical XY stage Focus Coaxial coarse and fine focusing Fine adjustment 1 µm per Scale Focus range 25 mm Illumination Halogen lighting with adjustable light intensity Power supply 100–240 V, 50/60 Hz Included lenses Lens Magnification Numerical aperture Working distance Olympus MPLNFL N 4× NA 0.10 approx. 18 mm Olympus MPLANFL N 10× NA 0.25 approx. 10.6 mm Optionally available: 20× lens 50× lens 100× lens Other Olympus UIS2 lenses on request Dimensions Width: approx. 283 mm Depth: approx. 464 mm Height: approx. 465 mm Weight: approx. 10 kg (depending on configuration) Applications The The Olympus BX51M with DIC is ideal for: Metallography Materials testing Semiconductor inspection Electronics and PCB inspection Analysis of coatings and thin layers Quality control Industrial laboratories Universities and research institutes Thanks to the combination of Differential Interference Contrast (DIC), high-quality Olympus plan lenses, and the ability to connect a camera, the Olympus BX51M delivers exceptional image quality for both visual inspection and digital documentation. Furthermore, the modular design makes it easy to expand the system with additional lenses and accessories, allowing it to be fully tailored to your specific research or inspection applications.